Innovative – reliable – robust
In-house development – made in Germany
Thermal management
3-stage active thermal management
Avoiding heat
By using only industrial-grade components in the motherboard development, heat generation is already avoided in the first development phase. Compared to consumer components, industrial components consume significantly less energy and generate correspondingly less heat. At the same time, the components are more resistant to extreme temperatures, which further increases the likelihood of a long service life.
The arrangement of the components within the enclosure – so to speak, the spatial planning of IPC components on the motherboard – plays an important role in avoiding heat in the device and is part of the noax industrial computer development process.
Distributing heat
Even when only industrial-grade components are used, controlled heat dissipation is of utmost importance. The second stage of noax’s thermal management ensures targeted distribution of heat through thermal flow simulations during the development phase.
With numerous load and climate tests, hotspots are identified and prevented through appropriate design during the development phase. This guarantees a service life of decades with maximum computing power.
Dissipating heat
By using materials that are as conductive as possible in combination with heat flows that are tailored to them, the heat is efficiently dissipated to the outside via the back of the HMI. These materials, often selected due to their high thermal conductivity, enable the heat generated to be dissipated quickly and effectively. This not only regulates the temperature of the touch PC, but also extends the lifespan of the electronic components. In addition, this cooling system helps to improve performance by preventing overheating.
By dissipating heat to the outside in a targeted manner, the energy efficiency of the entire system is also increased.